Bondada Engineering Limited IPO Detail
Incorporated in 2012, Bondada Engineering Limited provides engineering, procurement, and construction (EPC) services and operations and maintenance (O&M) services to companies operating in the telecom and solar energy industry.
The company provides passive telecom infrastructure services which include cell site construction, erection, operation, and maintenance of telecom towers with civil, electrical, and mechanical works; supply of poles and towers, laying and maintenance of optical fiber cables, supply of power equipment and other telecom infrastructure related services to major telecom companies and telecom tower operators in India. The company has installed over 11,600 telecom towers and poles out of which, 7,700 telecom towers and poles were installed in the last three fiscal.
Bondada Engineering also provides O&M services to telecom and tower operating companies such as cell site maintenance with preventive and corrective maintenance of passive infrastructure and equipment, backup power systems, manning services and supply of riggers, surveillance, and corrective maintenance of optical fiber cable routes and other maintenance related facilities.
Bondada's manufacturing facility is located in Keesara Mandal, Medchal, Telangana, with an installation capacity of ~12 thousand MTPA for tower fabrication.
The company has over 550 employees.
Company Promoters
Raghavendra Rao Bondada, Neelima Bondada and Satyanarayana Baratam are the promoters of the company.IPO Details
| IPO Opening Date | Aug 18, 2023 |
| IPO Closing Date | Aug 22, 2023 |
| Issue Type | Fixed Price Issue IPO |
| Face Value | ₹10 per equity share |
| IPO Price | ₹75 per equity share |
| Market Lot | 1600 Shares |
| Min Order Quantity | 1600 Shares |
| Listing At | BSE SME |
| Issue Size | ₹42.72 Cr |
| Fresh Issue | 5,696,000 shares (aggregating up to ₹42.72 Cr) |
| Offer for Sale | - |
| Retail Portion | 35.00% |
IPO Subscription (Bidding Detail)
| AS On | QIB | SHNI | BHNI | NII | RII | TOTAL |
|---|---|---|---|---|---|---|
| Day 1 | 0.00x | - | - | 0.00x | 0.00x | 0.00x |
| Day 2 | 0.00x | - | - | 0.00x | 0.00x | 0.00x |
| Day 3 | 0.00x | - | - | 0.00x | 0.00x | 0.00x |
| Day 4 | - | - | 0.66x | 4.50x | 2.58x | |
| Day 5 | - | - | 6.49x | 24.54x | 17.54x | |
| Day 6 | - | - | 115.46x | 100.05x | 112.28x |
IPO Tentative Timetable
The Bondada Engineering Limited IPO open date is Aug 18, 2023, and the close date is Aug 22, 2023. The issue may list on Aug 30, 2023.
| IPO Open Date | Aug 18, 2023 |
| IPO Close Date | Aug 22, 2023 |
| Basis of Allotment Date | Aug 25, 2023 |
| Initiation of Refunds | Aug 28, 2023 |
| Credit of Shares to Demat Account | Aug 29, 2023 |
| IPO Listing Date | Aug 30, 2023 |
IPO Lot Size
The Bondada Engineering Limited IPO market lot size is 1600 shares. A retail-individual investor can apply for up to 1 lots (1600 shares or ₹120000).
| Application | Lots | Shares | Amount (Cut-off) |
|---|---|---|---|
| Minimum | 1 | 1600 | ₹120000 |
| Maximum | 1 | 1600 | ₹120000 |
IPO Promoter Holding
| Pre Issue Share Holding | 86.00% |
| Post Issue Share Holding |
Company Financials:
For the year/period ended (₹ in Lakhs)
| Financial Year | Total Assets | Total Revenue | Profit After Tax |
|---|---|---|---|
| 31-Mar-22 | 15761.73 | 33420.96 | 1013.53 |
| 31-Mar-23 | 25115.46 | 37095.77 | 1825.19 |
Objects of the Issue:
The company intends to utilize the net proceeds from the issue towards the funding of the following objects:
- To meet long-term working capital requirements, and
- General corporate purposes.
Bondada Engineering Limited IPO Registrar:
KFin Technologies Limited
Bondada Engineering Limited IPO Lead Manager(s):
Vivro Financial Services Private Limited
Company Contact Information:
Bondada Engineering Limited
1-1-27/37, Ashok Manoj Nagar Kapra
Hyderabad
Hyderabad
